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 MCP73837/8
Advanced Stand-Alone Li-Ion / Li-Polymer Battery Charge Management Controller with Autonomous AC-Adapter or USB-Port Source Selection
Features
* High Accuracy Preset Voltage Regulation: + 0.5% * Available Voltage Regulation Options: - 4.20V, 4.35V, 4.4V, or 4.5V * Complete Linear Charge Management Controller: - Autonomous Power Source Selection - Integrated Pass Transistors - Integrated Current Sense - Integrated Reverse Discharge Protection * Constant Current (CC) / Constant Voltage (CV) Operation with Thermal Regulation * Selectable USB-Port Charge Current: - Low: 1 Unit Load / High: 5 Unit Loads * Programmable AC-Adapter Charge Current: - 15 mA - 1000 mA * Two Charge Status Outputs * Power-Good Monitor: MCP73837 * Timer Enable: MCP73838 * Automatic Recharge: - Selectable Voltage Threshold * Automatic End-of-Charge Control: - Selectable Charge Termination Current Ratio - Selectable Safety Timer Period * Preconditioning of Deeply Depleted Cells - can be disabled * Battery Cell Temperature Monitor * UVLO (Undervoltage Lockout) * Automatic Power-Down when Input Power is Removed * Low-Dropout (LDO) Linear Regulator Mode * Numerous Selectable Options Available for a Variety of Applications: - Refer to Section 1.0 "Electrical Characteristics" for Selectable Options" - Refer to the "Product Identification System" for Standard Options * Temperature Range: -40C to 85C * Packaging: - 10-Lead 3 mm x 3 mm DFN - 10-Lead MSOP* * Consult Factory for MSOP Package Availability.
Applications
* Smart Phones and Personal Data Assistants (PDA) * Portable Media Players(PMP) * Ultra Mobile Devices(UMD) * Digital Cameras * MP3 Players * Bluetooth Headsets * Handheld Medical Devices * AC/USB Dual Source Li-Ion Battery Chargers
Description
The MCP73837 and MCP73838 devices are fully integrated linear Li-Ion / Li-Polymer battery chargers with autonomous power source selection. Along with its small physical size, the low number of external components required makes the MCP73837/8 ideally suitable for portable applications. The MCP73837/8 automatically selects the USB-Port or AC-Adapter as the power source for the system. For the USB-Port powered systems, the MCP73837/8 specifically adheres to the current limits governed by the USB specification. The host microcontroller can select from two preset maximum charge current rates of 100 mA (low power USB-port) or 500 mA (high power USB-port). With an AC-Adapter providing power to the system, an external resistor sets the magnitude of the system or charge current up to a maximum of 1A. The MCP73837/8 employs a constant current / constant voltage charge algorithm with selectable preconditioning and charge termination. The constant voltage regulation is fixed with four available options: 4.20V, 4.35V, 4.40V, or 4.50V, to accommodated the new emerging battery charging requirements. The MCP73837/8 limits the charge current based on die temperature during high power or high ambient conditions. This thermal regulation optimizes the charge cycle time while maintaining the device reliability. The MCP73837/8 are fully specified over the ambient temperature range of -40C to +85C. The MCP73837/8 devices are available in a 10-Lead, 3 mm x 3 mm, DFN package or in a 10-Lead MSOP package.
(c) 2007 Microchip Technology Inc.
DS22071A-page 1
MCP73837/8
Package Types
MCP73837/8 10-Lead DFN 3 mm x 3 mm VAC VUSB STAT1 STAT2 VSS 1 2 3 4 5 10 VBAT 9 THERM 8 PG (TE) 7 PROG2 6 PROG1 VAC 1 MCP73837/8 10-Lead MSOP 10 VBAT 9 THERM 8 PG (TE) 7 PROG2 6 PROG1
VUSB 2 STAT1 3 STAT2 4 VSS 5
Typical Applications
MCP73837 Typical Application
Ac-dc Adapter USB Port 4.7 F 1 k 1 k 1 k 1 2 3 VAC VUSB STAT1 STAT2 PG VBAT THERM VSS PROG2 PROG1 10 Thermsitor 9 4.7 F Single Li-Ion Cell
4.7 F
5 7 6 RPROG
4 8
Low Hi
MCP73838 Typical Application
Ac-dc Adapter USB Port 4.7 F 1 K 1 K 1 2 3 VAC VUSB STAT1 STAT2 VSS VBAT THERM 10 Thermsitor 9 4.7 F Cell 8 Low 7 Low 6 RPROG Hi Hi
4.7 F
TE PROG2 PROG1
4 5
DS22071A-page 2
(c) 2007 Microchip Technology Inc.
MCP73837/8
Functional Block Diagram (MCP73837/8)
VOREG 6 A VBAT
DIRECTION CONTROL VUSB
SENSEFET G=0.001 SENSEFET G=0.001
100 mA/500 mA
10k
2k VOREG
DIRECTION CONTROL VAC AC/USB CURRENT LIMIT
SENSEFET G=0.001 SENSEFET G=0.001 PROG1
+ 1k VREF -
AC/USB REFERENCE, BIAS, UVLO, AND SHDN VOREG VREF (1.21V) 310k 72.7k + 111k + PRECONDITION 470.6k 48k 10k + CA
UVLO
TERM PROG2 CHARGE CONTROL, TIMER, AND STATUS LOGIC CHARGE LTVT HTVT LDO PG (TE) + 470.6k + 6k STAT1
+ 157.3k VOREG + -
VA
STAT2
175k 50 A THERM
(c) 2007 Microchip Technology Inc.
+ 175k 121k 1M VSS
DS22071A-page 3
MCP73837/8
1.0 ELECTRICAL CHARACTERISTICS
Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
Absolute Maximum Ratings
VDDN ................................................................................7.0V All Inputs and Outputs w.r.t. VSS ............... -0.3 to (VDD+0.3)V Maximum Junction Temperature, TJ ............Internally Limited Storage temperature .....................................-65C to +150C ESD protection on all pins Human Body Model (1.5 kW in Series with 100 pF) ...... 4 kV Machine Model (200 pF, No Series Resistance) .............300V
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD= [VREG(typical) + 0.3V] to 6V, TA = -40C to +85C. Typical values are at +25C, VDD = [VREG (typical) + 1.0V] Parameters Supply Input Supply Voltage Supply Current VDD ISS VREG(Typ) +0.3V -- -- -- UVLO Start Threshold UVLO Stop Threshold UVLO Hysteresis UVLO Start Threshold UVLO Stop Threshold UVLO Hysteresis Regulated Charge Voltage VSTART VSTOP VHYS VSTART VSTOP VHYS VREG 3.35 3.25 -- 4.1 4.0 -- 4.179 4.328 4.378 4.477 Regulated Charge Voltage Tolerance Line Regulation Load Regulation Supply Ripple Attenuation VRTOL |(VBAT/ VBAT)/VDD| |VBAT/VBAT| PSRR -0.5 -- -- -- -- -- Current Regulation (Fast Charge Constant-Current Mode) AC-Adapter Fast Charge Current IREG 95 900 Note 1: 2: 3: 4: 105 1000 115 1100 mA mA PROG1 = 10 k PROG1 = 1 k, Note 2 TA=-5C to +55C -- 1900 110 75 0.6 3.45 3.35 75 4.15 4.1 55 4.20 4.35 4.40 4.50 -- 0.075 0.150 60 52 23 6 3000 300 100 5 3.55 3.45 -- 4.3 4.2 -- 4.221 4.372 4.422 4.523 +0.5 0.2 0.3 -- -- -- V A A A A V V mV V V mV V V V V % %/V % dB dB dB TA=-5C to +55C VDD=[VREG(typical)+1V] to 6V IOUT=30 mA IOUT=10 mA to 100 mA VDD=[VREG(typical)+1V] IOUT=10 mA, 10Hz to 1 kHz IOUT=10 mA, 10Hz to 10 kHz IOUT=10 mA, 10Hz to 1 MHz Note 1 Charging Charge Complete, No Battery Standby (PROG Floating) Shutdown (VDD < VBAT 100 mV or VDD < VSTOP) VDD= Low to High (USB-Port) VDD= High to Low (USB-Port) (USB-Port) (AC-Adapter) (AC-Adapter) (AC-Adapter) VDD=[VREG(typical)+1V] IOUT=30 mA TA=-5C to +55C Sym Min Typ Max Units Conditions
Voltage Regulation (Constant Voltage Mode)
The supply voltage (VDD) = VAC when input power source is from Ac-Adapter and the supply voltage (VDD) = VUSB when input power source is from USB-Port. The value is guaranteed by design and not production tested. The current is based on the ratio of selected current regulation (IREG). The maximum charge impedance has to be less than shutdown impedance for normal operation.
DS22071A-page 4
(c) 2007 Microchip Technology Inc.
MCP73837/8
DC CHARACTERISTICS (Continued)
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD= [VREG(typical) + 0.3V] to 6V, TA = -40C to +85C. Typical values are at +25C, VDD = [VREG (typical) + 1.0V] Parameters USB-Port Fast Charge Current Sym IREG Min 80 400 Maximum Output Current Limit Precondition Current Ratio IMAX IPREG / IREG -- 7.5 15 30 Precondition Current Threshold Ratio Precondition Hysteresis Charge Termination Charge Termination Current Ratio ITERM / IREG 3.75 5.6 7.5 15 Automatic Recharge Recharge Voltage Threshold Ratio Pass Transistor ON-Resistance ON-Resistance Battery Discharge Current Output Reverse Leakage Current IDISCHARGE -- -- -- Status Indicators - STAT1, STAT2, PG (MCP73837) Sink Current Low Output Voltage Input Leakage Current PROG1 Input (PROG1) Charge Impedance Range Shutdown Impedance PROG2 Inputs (PROG2) Input High Voltage Level Input Low Voltage Level Shutdown Voltage Level Input Leakage Current Note 1: 2: 3: 4: VIH VIL VSD ILK 0.8VDD -- 0.2VDD -- -- -- -- 7 -- 0.2VDD 0.8VDD 15 % % % A VPROG2 = VDD RPROG RPROG 1 70 -- -- -- 200 k k Note 4 Minimum Impedance for Shutdown ISINK VOL ILK -- -- -- 16 0.3 0.03 35 1 1 mA V A ISINK = 4 mA High Impedance, VDD on pin 0.1 0.55 -6 2 2 -15 A A A Standby (PROG1 or PROG2 Floating) Shutdown (VDD < VBAT 100 mV or VDD < VSTOP) Charge Complete RDSON -- 350 -- m VDD = 4.5V, TJ = 105C VRTH / VREG 92 95 94.0 97 96 99 % % VBAT High to Low TA=-5C to +55C 5 7.5 10 20 6.25 9.4 12.5 25 % % % % PROG1 = 1 k to 10 k TA=-5C to +55C Note 3 VPTH / VREG VPHYS 64 69 -- Typ 90 450 1200 10 20 40 100 66.5 71.5 120 69 74 -- Max 100 500 -- 12.5 25 50 Units mA mA mA % % % % % % mV VBAT High to Low VBAT Low to High Conditions PROG2 = Low PROG2 = High TA=-5C to +55C PROG1 < 833 Note 3 TA=-5C to +55C
Precondition Current Regulation (Trickle Charge Constant-Current Mode)
The supply voltage (VDD) = VAC when input power source is from Ac-Adapter and the supply voltage (VDD) = VUSB when input power source is from USB-Port. The value is guaranteed by design and not production tested. The current is based on the ratio of selected current regulation (IREG). The maximum charge impedance has to be less than shutdown impedance for normal operation.
(c) 2007 Microchip Technology Inc.
DS22071A-page 5
MCP73837/8
DC CHARACTERISTICS (Continued)
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD= [VREG(typical) + 0.3V] to 6V, TA = -40C to +85C. Typical values are at +25C, VDD = [VREG (typical) + 1.0V] Parameters Timer Enable (TE) Input High Voltage Level Input Low Voltage Level Input Leakage Current Thermistor Bias Thermistor Current Source Thermistor Comparator Upper Trip Threshold Upper Trip Point Hysteresis Lower Trip Threshold Lower Trip Point Hysteresis System Test (LDO) Mode Input High Voltage Level THERM Input Sink Current Bypass Capacitance VIH ISINK CBAT -- 3 1 4.7 VBAT + 10 mV -- 5.5 -- VDD - 0.1 20 -- V A F F V V Stand-by Or System Test Mode IOUT < 250 mA IOUT > 250 mA 2.3V < VBAT < VREG VDD Falling 2.3V < VBAT < VREG VDD Rising VT1 VT1HYS VT2 VT2HYS 1.20 -- 0.235 -- 1.23 -40 0.250 40 1.26 -- 0.265 -- V mV V mV VT2 High to Low VT1 Low to High ITHERM 47 50 53 A 2 k < RTHERM < 50 k VIH VIL ILK 2 -- -- -- -- 0.01 -- 0.8 1 V V A VTE = VDD Sym Min Typ Max Units Conditions
Automatic Power Down (SLEEP Comparator, Direction Control) Automatic Power Down Entry Threshold Automatic Power Down Exit Threshold Thermal Shutdown Die Temperature Die Temperature Hysteresis Note 1: 2: 3: 4: TSD TSDHYS -- -- 150 10 -- -- C C VPD VPDEXIT VBAT + 100 mV VBAT + 150 mV -- VBAT + 250 mV
The supply voltage (VDD) = VAC when input power source is from Ac-Adapter and the supply voltage (VDD) = VUSB when input power source is from USB-Port. The value is guaranteed by design and not production tested. The current is based on the ratio of selected current regulation (IREG). The maximum charge impedance has to be less than shutdown impedance for normal operation.
DS22071A-page 6
(c) 2007 Microchip Technology Inc.
MCP73837/8
AC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD = [VREG (typical) + 0.3V] to 6V. Typical values are at +25C, VDD = [VREG (typical) + 1.0V] Parameters UVLO Start Delay Current Regulation Transition Time Out of Precondition Current Rise Time Out of Precondition Precondition Comparator Filter Time Termination Comparator Filter Time Charge Comparator Filter Time Thermistor Comparator Filter Time Elapsed Timer Elapsed Timer Period tELAPSED 0 3.6 5.4 7.2 Status Indicators Status Output Turn-off Status Output Turn-on tOFF tON -- -- -- -- 500 500 s s ISINK = 1 mA to 0 mA ISINK = 0 mA to 1 mA 0 4.0 6.0 8.0 0 4.4 6.6 8.8 Hours Hours Hours Hours Timer Disabled tDELAY tRISE tPRECON tTERM tCHARGE tTHERM -- -- 0.4 0.4 0.4 0.4 -- -- 1.3 1.3 1.3 1.3 10 10 3.2 3.2 3.2 3.2 ms ms ms ms ms ms VBAT < VPTH to VBAT > VPTH IOUT Rising to 90% of IREG Average VBAT Rise/Fall Average IOUT Falling Average VBAT Falling Average THERM Rise/Fall Sym tSTART Min -- Typ -- Max 5 Units ms Conditions VDD Low to High
TEMPERATURE SPECIFICATIONS
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD = [VREG (typ.) + 0.3V] to 6V. Typical values are at +25C, VDD = [VREG (typ.) + 1.0V] Parameters Temperature Ranges Specified Temperature Range Operating Temperature Range Storage Temperature Range Thermal Package Resistances Thermal Resistance, 10-Lead MSOP Thermal Resistance, 10-Lead 3 mm x 3 mm DFN Note 1: JA JA -- -- 113 41 -- -- C/W C/W 4-Layer JC51-7 Standard Board, Natural Convection. Note 1 4-Layer JC51-7 Standard Board, Natural Convection TA TJ TA -40 -40 -65 -- -- -- +85 +125 +150 C C C Sym Min Typ Max Units Conditions
This represents the minimum copper condition on the PCB ( Printed Circuit Board).
(c) 2007 Microchip Technology Inc.
DS22071A-page 7
MCP73837/8
2.0
Note:
TYPICAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, VDD = [VREG(typical) + 1V], IOUT = 30 mA, and TA= +25C, Constant-voltage mode.
4.210 4.205 4.200 4.195 4.190 4.185 4.180 4.175 4.170 4.165 4.160 Battery Regulation Voltage (V)
IOUT = 50 mA
Output Leakage Current (A)
TEMP = 25C
2.0 1.6 1.2 0.8 0.4 0.0 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 Temperature (C)
VDD = Floating VBAT = 4.2V
IOUT = 10 mA
IOUT = 100 mA IOUT = 500 mA
IOUT = 1000 mA
4.5
4.8
5.0 5.3 5.5 Supply Voltage (V)
5.8
6.0
FIGURE 2-1: Battery Regulation Voltage (VBAT) vs. Supply Voltage (VDD).
Battery Regulation Voltage (V) 4.210 4.205 4.200 4.195 4.190 4.185 4.180 4.175 4.170 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 Ambient Temperature (C)
IOUT = 100 mA IOUT = 500 mA IOUT = 1000 mA IOUT = 10 mA IOUT = 50 mA
FIGURE 2-4: Output Leakage Current (IDISCHARGE) vs. Ambient Temperature (TA).
2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0
VDD = 5.2V
Output Leakage Current (A)
VDD = Floating TEMP = +25C
3.0 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4.0 4.1 4.2 Battery Voltage (V)
FIGURE 2-2: Battery Regulation Voltage (VBAT) vs. Ambient Temperature (TA).
0.50 0.45 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0.00 Battery Voltage (V)
FIGURE 2-5: Output Leakage Current (IDISCHARGE) vs. Battery Voltage (VBAT).
1000 900 800 700 600 500 400 300 200 100 0 1
Output Leakage Current (A)
VDD = VBAT TEMP = 25 C
VDD = 5.2V Temp = 25C
3.0 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4.0 4.1 4.2
IREG (mA)
6 11 16 21 26 31 36 41 46 51 56 61 RPROG (k)
FIGURE 2-3: Output Leakage Current (IDISCHARGE) vs. Battery Regulation Voltage (VBAT).
FIGURE 2-6: Charge Current (IOUT) vs. Programming Resistor (RPROG).
DS22071A-page 8
(c) 2007 Microchip Technology Inc.
MCP73837/8
Note: Unless otherwise indicated, VDD = [VREG(typical) + 1V], IOUT = 30 mA and TA= +25C, Constant-voltage mode.
1200 1150 1100 1050 1000 950 900 850 800 750 700 4.5 4.8 5.0 5.3 5.5 Supply Voltage (V)
Charge Current (mA)
Charge Current (mA)
RPROG = 1 k Temp = +25C
110 108 106 104 102 100 98 96 94 92 90
RPROG = 10 k VDD = 5.2V
5.8
6.0
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 Ambient Temperature (C)
FIGURE 2-7: Charge Current (IOUT) vs. Supply Voltage (VDD).
104 Charge Current (mA) 102 100 98 96 94 92 90 4.5 4.8 5.0 5.3 5.5 Supply Voltage (V) 5.8 6.0
FIGURE 2-10: Charge Current (IOUT) vs. Ambient Temperature (TA).
55 54 53 52 51 50 49 48 47 46 45 RPROG = 20 k VDD = 5.2V
Charge Current (mA)
RPROG = 10 k Temp = +25C
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 Ambient Temperature (C)
FIGURE 2-8: Charge Current (IOUT) vs. Supply Voltage (VDD).
1100 1050 Charge Current (mA) 1000 950 900 850 800 750 700 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 Ambient Temperature (C)
RPROG = 1 k VDD = 5.2V
FIGURE 2-11: Charge Current (IOUT) vs. Ambient Temperature (TA).
1200 1100 1000 900 800 700 600 500 400 300 200 100 0
RPROG = 1 k
Charge Current (mA)
25
35
45
55
65
75
85
95
105
115
125
135
145
Junction Temperature (C)
FIGURE 2-9: Charge Current (IOUT) vs. Ambient Temperature (TA).
FIGURE 2-12: Charge Current (IOUT) vs. Junction Temperature (TJ).
(c) 2007 Microchip Technology Inc.
DS22071A-page 9
155
MCP73837/8
Note: Unless otherwise indicated, VDD = [VREG(typical) + 1V], IOUT = 30 mA and TA= +25C, Constant-voltage mode.
600 550 500 450 400 350 300 250 200 150 100 50 0 25 35 45 55 65 75 85 95 105 115
125
135
145
155
Thermistor Current (mA)
RPROG = 2 k
52.0 51.5 51.0 50.5 50.0 49.5 49.0 48.5 48.0 47.5 47.0 -40 -30 -20 -10 0 10 20 30 40 50 Ambient Temperature (C)
Charge Current (mA)
VDD = 5.2V
60
70
100
80
Junction Temperature (C)
FIGURE 2-13: Charge Current (IOUT) vs. Junction Temperature (TJ).
120 110 100 90 80 70 60 50 40 30 20 10 0 25 35 45 55 65 75 85 95 105 115
RPROG = 10 k
FIGURE 2-16: Thermistor Current (ITHERM) vs. Ambient Temperature (TA).
0 -10 Attenuation (dB) -20 -30 -40 -50 -60
Charge Current (mA)
IOUT = 10 mA COUT = 4.7 F
125
135
145
155
-70 0.01
0.1
1
10
Junction Temperature (C)
Frequency (kHz)
FIGURE 2-14: Charge Current (IOUT) vs. Junction Temperature (TJ).
52.0 51.5 51.0 50.5 50.0 49.5 49.0 48.5 48.0 47.5 47.0 4.5 4.8 5.0 5.3 5.5 Supply Voltage (V)
FIGURE 2-17: Power Supply Ripple Rejection (PSRR).
0 -10 Attenuation (dB) -20 -30 -40 -50 -60 -70 0.01 0.1 1 10 100 1000
Thermistor Current (mA)
Temp = +25C
IOUT = 100 mA COUT = 4.7 F
5.8
6.0
Frequency (kHz)
FIGURE 2-15: Thermistor Current (ITHERM) vs. Supply Voltage (VDD).
FIGURE 2-18: Power Supply Ripple Rejection (PSRR).
DS22071A-page 10
(c) 2007 Microchip Technology Inc.
90
1000
MCP73837/8
Note: Unless otherwise indicated, VDD = [VREG(typical) + 1V], IOUT = 30 mA and TA= +25C, Constant-voltage mode.
16 14 Input Source (V) 12 10 8 6 4 2 0 -200 16 14 Input Source (V) 12 10 8 6 4 2 0 -200 0.35 0.3 0.25 0.2 0.15 0.1 0.05 0 -0.05 -4.0E-04 -2.0E-04 0.0E+00 2.0E-04 4.0E-04 6.0E-04 8.0E-04 Output Current (A) -100 100 200 300 400 500 600 700 800 0
Time (s)
IOUT = 10 mA
0.1
-0.1 -0.2 -0.3 -0.4
IOUT = 100 mA
Output Ripple (V)
0
1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -0.1 -4.0E-04 -2.0E-04 2.0E-04 4.0E-04 6.0E-04 8.0E-04 0.0E+00
Output Current (A)
1.0E-03
1.2E-03
1.4E-03
-0.5
Time (s)
Time (Minutes)
FIGURE 2-19:
Line Transient Response.
0.1 Output Ripple (V) 0 -0.1 -0.2 -0.3 -0.4 -0.5
FIGURE 2-22:
Load Transient Response.
FIGURE 2-20:
Line Transient Response.
FIGURE 2-23: (IOUT = 1A).
VAC UVLO Start Delay
Time (Minutes)
FIGURE 2-21:
Load Transient Response.
Output Ripple (V)
IOUT = 10 mA
0.04 0.02 0 -0.02 -0.04 -0.06 -0.08 -0.1 -0.12 1.6E-03
FIGURE 2-24: (USB = Low).
VUSB UVLO Start Delay
(c) 2007 Microchip Technology Inc.
DS22071A-page 11
1.6E-03
Output Ripple (V)
IOUT = 100 mA
0.1 0.05 0 -0.05 -0.1 -0.15 -0.2 -0.25 -0.3
-100
100
200
300
400
500
600
700
0
1.0E-03
1.2E-03
1.4E-03
MCP73837/8
Note: Unless otherwise indicated, VDD = [VREG(typical) + 1V], IOUT = 30 mA and TA= +25C, Constant-voltage mode.
UVLOVAC
5.0 Battery Voltage (V) 4.0 3.0 2.0 1.0 0.0 0 20 40 60 80 100 120 140 160 180 Time (Minutes)
VDD = 5.2V RPROG = USB_Low 180 mAh Li-Ion Battery
0.12 Charge Current (A) Charge Current (A) 0.1 0.08 0.06 0.04 0.02 0
FIGURE 2-25: (USB = High)
5.0 Battery Voltage (V) 4.0 3.0 2.0 1.0 0.0
VUSB UVLO Start Delay
FIGURE 2-28: Complete Charge Cycle (180 mAh Li-Ion Battery).
5.0
C.C. Begins
1.2 Charge Current (A)
Battery Voltage (V)
0.12 0.1 0.08
C.V. Begins
1 0.8 0.6 0.4
VDD = 5.2V RPROG = 1 k 1200 mAh Li-Ion Battery
4.0 3.0 2.0 1.0
Preconditioning VDD = 5.2V RPROG = USB_Low 180 mAh Li-Ion Battery
0.06 0.04 0.02 0
0.2 0
0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150
0.0 0 1 2 3 4 5 6 7 8 9 10 Time (Minutes)
Time (Minutes)
FIGURE 2-26: Complete Charge Cycle (1200 mAh Li-Ion Battery).
4.5 4.0 Battery Voltage (V) 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 1 2 3 4 5 6 7 8 9 10 Time (Minutes)
VDD = 5.2V RPROG = 1 k 1200 mAh Li-Ion Battery
FIGURE 2-29: Typical Charge Profile in Preconditioning and CC-CV (180 mAh Li-Ion Battery).
1.2 0.9 0.6 0.3 0 Charge Current (A)
FIGURE 2-27: Typical Charge Profile in Thermal Regulation (1200 mAh Li-Ion Battery).
DS22071A-page 12
(c) 2007 Microchip Technology Inc.
MCP73837/8
3.0 PIN DESCRIPTION
PIN FUNCTION TABLES
DFN-10 1 2 3 4 5 6 7 8 8 9 10 EP Symbol VAC VUSB STAT1 STAT2 VSS PROG1 PROG2 PG TE THERM VBAT VSS I/O I I O O -- I/O I O I I/O I/O -- AC-Adapter Supply Input USB-Port Supply Input Charge Status Output 1 (Open-Drain) Charge Status Output 2 (Open-Drain) Battery Management 0V Reference Current Regulation Setting With AC-Adapter; Device Charge Control Enable; Precondition Set Point for AC control Current Regulation Setting With USB-Port; Precondition Set Point for USB control. Available on MCP73837: Power-Good Status Output (Open-Drain) Available on MCP73838: Timer Enable; Enables Safety Timer (Active Low) Thermistor Monitoring Input and Bias current; System Test (LDO) Mode Input Battery Positive Input and Output Connection EP (Exposed Thermal Pad); There is an internal electrical connection between the exposed thermal pad and VSS. The EP must be connected to the same potential as the VSS pin on the Printed Circuit Board (PCB). Function The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
MSOP-10 1 2 3 4 5 6 7 8 8 9 10 --
Pin Number
3.1
AC-Adapter Supply Input (VAC)
3.5
A supply voltage of VREG + 0.3V to 6V from ac-dc walladapter is recommended. When both the AC-Adapter and the USB-Port supply voltages are present at same time, the AC-Adapter dominates the regulated charge current with the maximum value of 1A. Bypass to VSS with a minimum of 4.7 F is recommended.
Battery Management 0V Reference (VSS)
Connect to negative terminal of battery and input supply.
3.6
Battery Charge Control Output (VBAT)
3.2
USB-Port Supply Input (VUSB)
A supply voltage of VREG + 0.3V to 6V from USB-Port is recommended. When no supply voltage from VAC pin is available, the Li-Ion battery is charged directly from USB-Port. Bypass to VSS with a minimum of 1 F is recommended.
Connect to the positive terminal of Li-Ion / Li-Polymer batteries. Bypass to VSS with a minimum of 1 F to ensure loop stability when the battery is disconnected.
3.7
AC-Adapter Current Regulation Set (PROG1)
3.3
Charge Status Output 1 (STAT1)
STAT1 is an open-drain logic output for connection to a LED for charge status indication. Alternatively, a pull-up resistor can be applied for interfacing to a host microcontroller.
The AC-Adapter constant charge current is set by placing a resistor from PROG1 to VSS. PROG1 is the set point of precondition and termination when the ACAdapter is present. PROG1 also functions as device charge control enable. The MCP73837/8 is shut down when an impedance value greater than 70 k is applied to PROG1. When PROG1 is floating, the MCP73837/8 enters stand-by mode.
3.4
Charge Status Output 2 (STAT2)
STAT2 is an open-drain logic output for connection to a LED for charge status indication. Alternatively, a pull-up resistor can be applied for interfacing to a host microcontroller.
(c) 2007 Microchip Technology Inc.
DS22071A-page 13
MCP73837/8
3.8 USB-Port Current Regulation Set (PROG2) 3.10 Timer Enable (TE)
Timer Enable (TE) is available only on MCP73838. (TE) enables the built-in safety timer when pull low and disables the built-in safety timer when pull high. Note: The built-in safety timer is available for both MCP73837 and MCP73838 in the following options: Disable, 4 HR, 6 HR, and 8 HR.
The MCP73837/8 USB-Port current regulation set input (PROG2) is a digital input selection. A logic Low selects a 1 unit load charge current; a logic High selects a 5 unit loads charge current. PROG2 also functions as the set point of precondition and termination when USB-Port is present. When PROG2 is floating, the MCP73837/8 enters in stand-by mode.
3.11
Battery Temperature Monitor (THERM)
3.9
Power Good (PG)
Power Good (PG) is available only on MCP73837. PG is an open-drain logic output for connection to a LED for input power supply indication. Alternatively, a pullup resistor can be applied for interfacing to a host microcontroller.
MCP73837/8 continuously monitors the battery temperature during a charge cycle by measuring the voltage between the THERM and VSS pins. An internal 50 A current source provides the bias for the most common 10 k negative-temperature coefficient thermistors (NTC).
DS22071A-page 14
(c) 2007 Microchip Technology Inc.
MCP73837/8
4.0 DEVICE OVERVIEW
The MCP73837/8 devices are simple, yet fully integrated linear charge management controllers. Figure 4-1 depicts the operational flow algorithm.
SHUTDOWN MODE* V STAT1 = Hi-Z STAT2 = Hi-Z PG = Hi-Z
* Continuously Monitored
SYSTEM TEST (LDO) MODE V > (V -100 mV) THERM DD STAT1 = LOW STAT2 = LOW PG = LOW Timer Suspended
STANDBY MODE *
V
BAT
> (V
REG
+100 mV)
PROG > 200k STAT1 = Hi-Z STAT2 = Hi-Z PG = LOW VBAT < V PTH PRECONDITIONING MODE Charge Current = IPREG STAT1 = LOW STAT2 = Hi-Z PG = LOW Timer Reset V
BAT
>V
PTH
TEMPERATURE FAULT No Charge Current STAT1 = Hi-Z STAT2 = Hi-Z PG = LOW Timer Suspended
FAST CHARGE MODE Charge Current = IREG STAT1 = LOW STAT2 = Hi-Z PG = LOW Timer Enabled VBAT = V REG CONSTANT VOLTAGE MODE Charge Voltage = VREG STAT1 = LOW STAT2 = Hi-Z PG = LOW
VBAT > V PTH Timer Expired VBAT < VRTH
TIMER FAULT No Charge Current STAT1 = Hi-Z STAT2 = Hi-Z PG = LOW Timer Suspended
IBAT < I TERM
Timer Expired
CHARGE COMPLETE MODE No Charge Current STAT1 = Hi-Z STAT2 = LOW PG = LOW
FIGURE 4-1:
Flow Chart.
(c) 2007 Microchip Technology Inc.
DS22071A-page 15
MCP73837/8
4.1 Undervoltage Lockout (UVLO)
An internal undervoltage lockout (UVLO) circuit monitors the input voltage and keeps the charger in shutdown mode until the input supply rises above the UVLO threshold. The UVLO circuitry has a built-in hysteresis of 75 mV for the USB-Port and 55 mV for the AC-Adapter. In the event a battery is present when the input power is applied, the input supply must rise 100 mV above the battery voltage before MCP73837/8 becomes operational. The UVLO circuit places the device in shutdown mode if the input supply falls to within +100 mV of the battery voltage. The UVLO circuit is always active. At any time the input supply is below the UVLO threshold or within +100 mV of the voltage at the VBAT pin, the MCP73837/8 is placed in a shutdown mode. During any UVLO condition, the battery reverse discharge current shall be less than 2 A. In this mode, the MCP73837/8 supplies a percentage of the charge current (established with the value of the resistor connected to the PROG pin) to the battery. The percentage or ratio of the current is factory set. Refer to Section 1.0 "Electrical Characteristics" for preconditioning current options. When the voltage at the VBAT pin rises above the preconditioning threshold, the MCP73837/8 enters the constant current or fast charge mode.
4.5
Constant Current MODE - Fast Charge
During the constant current mode, the programmed (AC-Adapter) or selected (USB-Port) charge current is supplied to the battery or load. For AC-Adapter, the charge current is established using a single resistor from PROG to VSS. The program resistor and the charge current are calculated using the following equation:
EQUATION 4-1:
1000V I REG = ---------------R PROG where RPROG is in kilo-ohms (k) and IREG is in milliampers (mA). When charging from a USB-Port, the host microcontroller has the option of selecting either a one unit load or a five unit loads charge rate based on the PROG2 input. A logic LOW selects a one unit load charge rate, a HIGH selects a five unit loads charge rate, and high impedance input suspends or disables charging. Note: USB Specification Rev. 2.0 defines the maximum absolute current for one unit load is 100 mA. This value is not an average over time and shall not be exceed.
4.2
AUTONOMOUS POWER SOURCE SELECTION
The MCP73837/8 devices are designed to select the USB-port or the AC-Adapter as the power source automatically. If the AC-Adapter input is not present, the USB-Port is selected. If both inputs are available, the AC-Adapter has first priority. Note: If the input power is switched during a charge cycle, the power path switch-over shall be a break-before-make connection. As a result, the charge current can momentarily go to zero. The charge cycle timer shall remain continuous.
4.3
Charge Qualification
For a charge cycle to begin, all UVLO conditions must be met and a battery or output load must be present. A charge current programming resistor must be connected from PROG1 to VSS. If the PROG1 or PROG2 pin are open or floating, the MCP73837/8 is disabled and the battery reverse discharge current is less than 2 A. In this manner, the PROG1 pin acts as a charge enable and can be used as a manual shutdown.
Constant current mode is maintained until the voltage at the VBAT pin reaches the regulation voltage, VREG., when constant current mode is invoked, the internal timer is reset.
4.5.1
4.4
Preconditioning
TIMER EXPIRED DURING CONSTANT CURRENT - FAST CHARGE MODE
If the voltage at the VBAT pin is less than the preconditioning threshold, the MCP73837/8 enters a preconditioning mode. The preconditioning threshold is factory set. Refer to Section 1.0 "Electrical Characteristics" for preconditioning threshold options.
If the internal timer expires before the recharge voltage threshold is reached, a timer fault is indicated and the charge cycle terminates. The MCP73837/8 remains in this condition until the battery is removed, the input battery is removed or the PROG1/2 pin is opened. If the battery is removed or the PROG1/2 pin is opened, the MCP73837/8 enters the Stand-by mode where it remains until a battery is reinserted or the PROG1/2 pin
DS22071A-page 16
(c) 2007 Microchip Technology Inc.
MCP73837/8
is reconnected. If the input power is removed, the MCP73837/8 is in Shutdown. When the input power is reapplied, a normal start-up sequence ensues.
4.9
Thermal Regulation
4.6
Constant Voltage Mode
When the voltage at the VBAT pin reaches the regulation voltage, VREG, constant voltage regulation begins. The regulation voltage is factory set to 4.20V, 4.35V, 4.40V, or 4.5V with a tolerance of 0.5%.
The MCP73837/8 limits the charge current based on the die temperature. The thermal regulation optimizes the charge cycle time while maintaining device reliability. Figure 4-2 depicts the thermal regulation for the MCP73837/8. Refer to Section 1.0 "Electrical Characteristics" for thermal package resistances and Section 6.1.1.2 "Thermal Considerations" for calculating power dissipation.
.
4.7
Charge Termination
1200 1100 1000
The charge cycle is terminated when, during constant voltage mode, the average charge current diminishes below a percentage of the programmed charge current (established with the value of the resistor connected to the PROG pin) or the internal timer has expired. A 1 ms filter time on the termination comparator ensures that transient load conditions do not result in premature charge cycle termination. The percentage or ratio of the current is factory set. The timer period is factory set and can be disabled. Refer to Section 1.0 "Electrical Characteristics" for charge termination current ratio and timer period options. The charge current is latched off and the MCP73837/8 enters a charge complete mode.
RPROG = 1 k
Charge Current (mA)
900 800 700 600 500 400 300 200 100 0
25
35
45
55
65 75 85 95 105 115 125 135 145 155 Junction Temperature (C)
FIGURE 4-2:
Thermal Regulation.
4.10
Thermal Shutdown
4.8
Automatic Recharge
The MCP73837/8 continuously monitors the voltage at the VBAT pin in the charge complete mode. If the voltage drops below the recharge threshold, another charge cycle begins and current is once again supplied to the battery or load. The recharge threshold is factory set. Refer to Section 1.0 "Electrical Characteristics" for recharge threshold options. Note: Charge termination and automatic recharge features avoid constant charging Li-Ion batteries to prolong the life of Li-Ion batteries while keeping their capacity at healthy level.
The MCP73837/8 suspends charge if the die temperature exceeds 150C. Charging will resume when the die temperature has cooled by approximately 10C. The thermal shutdown is a secondary safety feature in the event that there is a failure within the thermal regulation circuitry.
(c) 2007 Microchip Technology Inc.
DS22071A-page 17
MCP73837/8
5.0
5.1
5.1.1
DETAILED DESCRIPTION
Analog Circuitry
BATTERY MANAGEMENT INPUT SUPPLY (VDD)
at the THERM pin to factory set thresholds of 1.20V and 0.25V, typically. Once a voltage outside the thresholds is detected during a charge cycle, the MCP73837/8 immediately suspends the charge cycle. The MCP73837/8 suspends charge by turning off the pass transistor and holding the timer value. The charge cycle resumes when the voltage at the THERM pin returns to the normal range. If temperature monitoring is not required, place a standard 10 k resistor from THERM to VSS.
The VDD input is the input supply to the MCP73837/8. The MCP73837/8 can be supplied by either ACAdapter (VAC) or USB-Port (VUSB) with autonomous source selection. The MCP73837/8 automatically enters a Power-down mode if the voltage on the VDD input falls to within +100 mV of the battery voltage or below the UVLO voltage (VSTOP). This feature prevents draining the battery pack when both the VAC and VUSB supplies are not present.
5.1.5
SYSTEM TEST (LDO) MODE
5.1.2
AC-ADAPTER CURRENT REGULATION SET (PROG1)
For the MCP73837/8, the charge current regulation can be scaled by placing a programming resistor (RPROG) from the PROG input to VSS. The program resistor and the charge current are calculated using the following equation:
The MCP73837/8 can be placed in a system test mode. In this mode, the MCP73837/8 operates as a low dropout linear regulator (LDO). The output voltage is regulated to the factory set voltage regulation option. The available output current is limited to the programmed fast charge current. For stability, the VBAT output must be bypassed to VSS with a minimum capacitance of 1 F for output currents up to 250 mA. A minimum capacitance of 4.7 F is required for output currents above 250 mA. The system test mode is entered by driving the THERM input greater than (VDD - 100 mV) with no battery connected to the output. In this mode, the MCP73837/ 8 can be used to power the system without a battery being present. Note 1: ITHERM is disabled during shutdown, stand-by, and system test modes. 2: A pull-down current source on the THERM input is active only in stand-by and system test modes. 3: During system test mode, the PROG input sets the available output current limit. 4: System test mode shall be exited by releasing the THERM input or cycling input power.
EQUATION 5-1:
1000V I REG = ---------------R PROG = = kilo-ohms (k) milli-ampere (mA)
Where: RPROG IREG
The preconditioning current and the charge termination current are ratiometric to the fast charge current based on the selected device options.
5.1.3
BATTERY CHARGE CONTROL OUTPUT (VBAT)
The battery charge control output is the drain terminal of an internal P-channel MOSFET. The MCP73837/8 provides constant current and voltage regulation to the battery pack by controlling this MOSFET in the linear region. The battery charge control output should be connected to the positive terminal of the battery pack.
5.2
5.2.1
Digital Circuitry
STATUS INDICATORS AND POWER GOOD (PG) OPTION
5.1.4
TEMPERATURE QUALIFICATION (THERM)
The MCP73837/8 continuously monitors battery temperature during a charge cycle by measuring the voltage between the THERM and the VSS pins. An internal 50 A current source provides the bias for the most common 10 k negative-temperature coefficient (NTC) or positive-temperature coefficient (PTC) thermistors. The current source is controlled, avoiding measurement sensitivity to fluctuations in the supply voltage (VDD). The MCP73837/8 compares the voltage
The charge status outputs have two different states: Low (L), and High Impedance (Hi-Z). The charge status outputs can be used to illuminate LEDs. Optionally, the charge status outputs can be used as an interface to a host microcontroller. Table 5-1 summarizes the state of the status outputs during a charge cycle.
DS22071A-page 18
(c) 2007 Microchip Technology Inc.
MCP73837/8
5.2.2 USB-PORT CURRENT REGULATION SELECT (PROG2) 5.2.4 TIMER ENABLE (TE) OPTION
For the MCP73837/8, driving the PROG2 input to a logic Low selects the low charge current setting (maximum 100 mA). Driving the PROG2 input to a logic High selects the high charge current setting (maximum 500 mA). The timer enable (TE) input option is used to enable or disable the internal timer. A low signal on this pin enables the internal timer and a high signal disables the internal timer. The TE input can be used to disable the timer when the charger is supplying current to charge the battery and power the system load. The TE input is compatible with 1.8V logic. The TE option is available only on MCP73838.
TABLE 5-1:
Shutdown Standby Preconditioning Constant Current Constant Voltage
STATUS OUTPUTS
STAT1 Hi-Z Hi-Z L L L Hi-Z Hi-Z Hi-Z L STAT2 Hi-Z Hi-Z Hi-Z Hi-Z Hi-Z L Hi-Z Hi-Z L PG Hi-Z L L L L L L L L
CHARGE CYCLE STATE
5.2.5
DEVICE DISABLE (PROG1/2)
Charge Complete - Standby Temperature Fault Timer Fault System Test Mode
The current regulation set input pin (PROG1/2) can be used to terminate a charge at any time during the charge cycle, as well as to initiate a charge cycle or to initiate a recharge cycle. Placing a programming resistor from the PROG1/2 input to VSS enables the device. Allowing the PROG1/2 input to float or applying a logic-high input signal, disables the device and terminates a charge cycle. When disabled, the device's supply current is reduced to 75 A, typically.
5.2.3
POWER GOOD (PG) OPTION
The power good (PG) option is a pseudo open-drain output. The PG output can sink current, but not source current. However, there is a diode path back to the input, and as such, the output should be pulled up only to the input. The PG output is low whenever the input to the MCP73837 is above the UVLO threshold and greater than the battery voltage. If the supply voltage is above the UVLO, but below VREG(typical)+0.3V, the MCP73837 will pulse the PG output as the device determines if a battery is present. The PG option is available only on MCP73837.
(c) 2007 Microchip Technology Inc.
DS22071A-page 19
MCP73837/8
6.0 APPLICATIONS
The MCP73837/8 devices are designed to operate in conjunction with a host microcontroller or in standalone applications. The MCP73837/8 devices provide the preferred charge algorithm for Lithium-Ion and Lithium-Polymer cells Constant-current followed by Constant-voltage. Figure 6-1 depicts a typical standalone MCP73837 application circuit, while Figure 6-2 and Figure 6-3 depict the accompanying charge profile.
1 2
1
VAC VUSB STAT1 STAT2 /PG
VBAT THERM
V
10 Thermsitor 9 COUT Single Li-Ion Cell
CIN1 REGULATED WALL CUBE
USB Port CIN2
3 4 8
SS
5 7 6 RPROG
1 1
PROG2 PROG1
Low
Hi
MCP73837
FIGURE 6-1:
5.0 Battery Voltage (V) 4.0 3.0 2.0 1.0 0.0
MCP73837 Typical Stand-Alone Application Circuit.
6.1
1.2 Charge Current (A) 1 0.8 0.6 0.4
VDD = 5.2V RPROG = 1 k 1200 mAh Li-Ion Battery
Application Circuit Design
0.2 0
Time (Minutes)
Due to the low efficiency of linear charging, the most important factors are thermal design and cost, which are a direct function of the input voltage, output current, and thermal impedance between the battery charger and the ambient cooling air. The worst-case situation is when the device has transitioned from the Preconditioning mode to the Constant Current mode. In this situation, the battery charger has to dissipate the maximum power. A trade-off must be made between the charge current, cost, and thermal requirements of the charger.
0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150
FIGURE 6-2: Typical Charge Profile (1200 mAh Li-Ion Battery).
4.5 4.0 Charge Current (A) Battery Voltage (V) 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 1 2 3 4 5 6 7 8 9 10 Time (Minutes)
VDD = 5.2V RPROG = 1 k 1200 mAh Li-Ion Battery
6.1.1
COMPONENT SELECTION
1.2 0.9 0.6 0.3 0
Selection of the external components in Figure 6-1 is crucial to the integrity and reliability of the charging system. The following discussion is intended as a guide for the component selection process.
6.1.1.1
Charge Current
The preferred fast charge current for Lithium-Ion cells should always follow references and guidance from battery manufacturers. For example, programming 700 mA fast charge current for a 1000 mAh Li-Ion battery pack if its preferred fast charge rate is 0.7C. This will result the shortest charge cycle time without degradation a battery's life and performance.
6.1.1.2
Thermal Considerations
FIGURE 6-3: Typical Charge Profile in Thermal Regulation (1200 mAh Li-Ion Battery).
The worst-case power dissipation in the battery charger occurs when the input voltage is at the maximum and the device has transitioned from the Preconditioning mode to the Constant-current mode. In this case, the power dissipation is:
DS22071A-page 20
(c) 2007 Microchip Technology Inc.
MCP73837/8
EQUATION 6-1:
PowerDissipation = ( V DDMAX -V PTHMIN )xI REGMAX
Where: VDDMAX IREGMAX VPTHMIN = = = the maximum input voltage the maximum fast charge current the minimum transition threshold voltage
Placing a programming resistor from the PROG1 input to VSS or driving PROG2 to logic High or Low enables the device. Allowing either the PROG1 or PROG2 input float disables the device and terminates a charge cycle. When disabled, the device's supply current is reduced to 75 A, typically.
6.1.1.6
Temperature Monitoring
For example, power dissipation with a 5V, 10% input voltage source and 500 mA, 10% fast charge current is:
The charge temperature window can be set by placing fixed value resistors in series-parallel with a thermistor. The resistance values of RT1 and RT2 can be calculated with the following equations in order to set the temperature window of interest. For NTC thermistors:
EXAMPLE 6-1:
PowerDissipation = ( 5.5V - 2.7V ) x 550mA = 1.54W
EQUATION 6-2:
R T2 x R COLD 24k = R T1 + -------------------------------R T2 + R COLD R T2 x R HOT 5k = R T1 + ---------------------------R T2 + R HOT Where:
RT1
This power dissipation with the battery charger in the MSOP-10 package will cause thermal regulation to be entered as depicted in Figure 6-3. Alternatively, the 3 mm x 3 mm DFN package could be utilized to reduce the charge cycle times.
= =
the fixed series resistance the fixed parallel resistance the thermistor resistance at the lower temperature of interest
6.1.1.3
External Capacitors
RT2 RCOLD RHOT
The MCP73837/8 is stable with or without a battery load. In order to maintain good AC stability in the Constant Voltage mode, a minimum capacitance of 1 F is recommended to bypass the VBAT pin to VSS. This capacitance provides compensation when there is no battery load. In addition, the battery and interconnections appear inductive at high frequencies. These elements are in the control feedback loop during Constant Voltage mode. Therefore, the bypass capacitance may be necessary to compensate for the inductive nature of the battery pack. Virtually any good quality output filter capacitor can be used, independent of the capacitor's minimum Effective Series Resistance (ESR) value. The actual value of the capacitor (and its associated ESR) depends on the output load current. A 1 F ceramic, tantalum, or aluminum electrolytic capacitor at the output is usually sufficient to ensure stability for output currents up to 500 mA.
=
the thermistor resistance at the upper temperature of interest
For example, by utilizing a 10 k at 25C NTC thermistor with a sensitivity index, , of 3892, the charge temperature range can be set to 0C - 50C by placing a 1.54 k resistor in series (RT1), and a 69.8 k resistor in parallel (RT2) with the thermistor.
6.1.1.7
Charge Status Interface
A status output provides information on the state of charge. The output can be used to illuminate external LEDs or interface to a host microcontroller. Refer to Figure 5-1 for a summary of the state of the status output during a charge cycle.
6.2
PCB Layout Issues
6.1.1.4
Reverse-Blocking Protection
The MCP73837/8 provides protection from a faulted or shorted input. Without the protection, a faulted or shorted input would discharge the battery pack through the body diode of the internal pass transistor.
For optimum voltage regulation, place the battery pack as close as possible to the device's VBAT and VSS pins, recommended to minimize voltage drops along the high current-carrying PCB traces. If the PCB layout is used as a heatsink, adding many vias in the heatsink pad can help conduct more heat to the backplane of the PCB, thus reducing the maximum junction temperature.
6.1.1.5
Charge Inhibit
The current regulation set input pin (PROG1/2) can be used to terminate a charge at any time during the charge cycle, as well as to initiate a charge cycle or initiate a recharge cycle.
(c) 2007 Microchip Technology Inc.
DS22071A-page 21
MCP73837/8
7.0
7.1
PACKAGING INFORMATION
Package Marking Information
10-Lead DFN
1 2 3 4 5 10
Part Number *
Marking Code
Part Number *
Marking Code BABA BABB BABC BACA BACB BACC
Example:
1 2 3 4 5 10
XXXX XYWW NNN
9 8 7 6
MCP73837-FCI/MF BABA MCP73837T-FCI/MF MCP73837-FJI/MF BABB MCP73837T-FJI/MF MCP73837-NVI/MF BABC MCP73837T-NVI/MF MCP73838-FCI/MF BACA MCP73838T-FCI/MF MCP73838-FJI/MF BACB MCP73838T-FJI/MF MCP73838-NVI/MF BACC MCP73838T-NVI/MF * Consult Factory for Alternative Device Options.
BABA 0748 256
9 8 7 6
10-Lead MSOP * * Part Number * Marking Code Part Number * Marking Code 837FCI 837FJI 837NVI 838FCI 838FJI 838NVI
Example:
XXXXXX YWWNNN
MCP73837-FCI/UN 837FCI MCP73837T-FCI/UN MCP73837-FJI/UN 837FJI MCP73837T-FJI/UN MCP73837-NVI/UN 837NVI MCP73837T-NVI/UN MCP73838-FCI/UN 838FCI MCP73838T-FCI/UN MCP73838-FJI/UN 838FJI MCP73838T-FJII/UN MCP73838-NVI/UN 838NVI MCP73838T-NVI/UN * Consult Factory for Alternative Device Options. * * Consult Factory for MSOP Package Availability.
837FCI 748256
Legend: XX...X Y YY WW NNN
e3
* Note:
Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.
DS22071A-page 22
(c) 2007 Microchip Technology Inc.
MCP73837/8
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DS22071A-page 23
MCP73837/8
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DS22071A-page 24
(c) 2007 Microchip Technology Inc.
MCP73837/8
APPENDIX A: REVISION HISTORY
Revision A (November 2007)
* Original Release of this Document.
(c) 2007 Microchip Technology Inc.
DS22071A-page 25
MCP73837/8
NOTES:
DS22071A-page 26
(c) 2007 Microchip Technology Inc.
MCP73837/8
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device XX X/ XX Examples: * *
a) b) c) d) e) f) a) b) c) d) e) f) MCP73837-FCI/UN: MCP73837-FJI/UN: MCP73837-NVI/UN: MCP73837-FCI/MF: MCP73837-FJI/MF: MCP73837-NVI/MF: MCP73838-FCI/UN: MCP73838-FJI/UN: MCP73838-NVI/UN: MCP73838-FCI/MF: MCP73838-FJI/MF: MCP73838-NVI/MF: 10-lead MSOP pkg. 10-lead MSOP pkg. 10-lead MSOP pkg. 10-lead DFN pkg. 10-lead DFN pkg. 10-lead DFN pkg. 10-lead MSOP pkg. 10-lead MSOP pkg. 10-lead MSOP pkg. 10-lead DFN pkg. 10-lead DFN pkg. 10-lead DFN pkg.
Output Temp. Package Options*
Device:
MCP73837: 1A Fully Integrated Charger, PG function on pin 8 MCP73837T: 1A Fully Integrated Charger, PG function on pin 8 (Tape and Reel) MCP73838: 1A Fully Integrated Charger, TE function on pin 8 MCP73838T: 1A Fully Integrated Charger, TE function on pin 8 (Tape and Reel) * Refer to table below for different operational options. * * Consult Factory for Alternative Device Options.
Output Options * *
* * Consult Factory for Alternative Device Options
Temperature: Package Type:
I
= -40C to +85C
MF = Plastic Dual Flat No Lead (DFN) (3x3x0.9 mm Body), 10-lead UN = Plastic Micro Small Outline Package (MSOP***), 10-lead
* Operational Output Options
Output Options AM BZ FC GP G8 NV YA 6S B6 CN VREG 4.20V 4.20V 4.20V 4.20V 4.20V 4.35V 4.40V 4.50V 4.20V 4.20V IPREG/IREG 10% 100% 10% 100% 10% 10% 10% 10% 10% 10% VPTH/VREG 71.5% N/A 71.5% N/A 71.5% 71.5% 71.5% 71.5% 66.5% 71.5% ITERM/IREG 7.5% 7.5% 7.5% 7.5% 7.5% 7.5% 7.5% 7.5% 5.0% 20% VRTH/VREG 96.5% 96.5% 96.5% 96.5% 96.5% 96.5% 96.5% 96.5% 96.5% 94% Timer Period 0 hours 0 hours 6 hours 6 hours 8 hours 6 hours 6 hours 6 hours 4 hours 4 hours
* * Consult Factory for Alternative Device Options. * * * Consult Factory for MSOP Package Availability
(c) 2007 Microchip Technology Inc.
DS22071A-page 27
MCP73837/8
NOTES:
DS22071A-page 28
(c) 2007 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices: * * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable."
* *
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights.
Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, rfPIC and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Linear Active Thermistor, Migratable Memory, MXDEV, MXLAB, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2007, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified.
(c) 2007 Microchip Technology Inc.
DS22071A-page 29
WORLDWIDE SALES AND SERVICE
AMERICAS
Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, IN Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, CA Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509
ASIA/PACIFIC
Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China - Fuzhou Tel: 86-591-8750-3506 Fax: 86-591-8750-3521 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 China - Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China - Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 China - Shunde Tel: 86-757-2839-5507 Fax: 86-757-2839-5571 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256
ASIA/PACIFIC
India - Bangalore Tel: 91-80-4182-8400 Fax: 91-80-4182-8422 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 India - Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 Japan - Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Malaysia - Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 Malaysia - Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Hsin Chu Tel: 886-3-572-9526 Fax: 886-3-572-6459 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350
EUROPE
Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820
10/05/07
DS22071A-page 30
(c) 2007 Microchip Technology Inc.


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